Selected articles for topic: rf flip chip
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STATS ChipPAC - Flip Chip Packages
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Flip Chip Packages
A broad Flip Chip portfolio--from large single die packages with passive components to modules and complex advanced 3D packaging, with a variety of low cost options.
Your Go-To Provider of Flip Chip Solutions
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides the most dense interconnect...
Website:
http://www.statschippac.com
Related topics : rf flip chip / single chip rf
Advanced flip chip technologies in rf, microwave, and MEMS ...
A variety of flip chip technologies are available today which differ in bumping material, substrate type, pad metallization and joining method. They are found in packages as well as on multichip modules and directly flip chip bonded on the board. Components including flip chip like bal grid arrays and chip size packages are introduced. Flip chip is the most favored assembly technology for high frequency applications due to the small parasitic of the short bump interconnect. High performance packages for optoelectronic devices using self-alignment during a fluxless reflow soldering are shown as...
Website:
http://proceedings.spiedigitallibrary.org
Related topics : rf flip chip / rf modulator chip
STATS ChipPAC - Flip Chip Packages
Your Go-To Provider for a Broad Range of Advanced and Standard Flip Chip Package Solutions
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides a dense interconnect with the high electrical and thermal performance.??lip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and...
Website:
http://www.statschippac.com
Related topics : rf flip chip / rf chip design process
Executive Signal Blocking Case - Blocks Cell Phone Signals
Executive Signal Blocking Case - Block Cell Phone Signals
Executive Signal Blocking Case
Block Cell Phone Signals
The Executive Signal Blocking Case is a cell phone case that blocks wireless signals. Keep your cell phone from being used as a listening device during important meetings. Simply put your cell phone...
Date: 2015-08-07 17:35:17
Website:
http://www.spytechs.com
Related topics : rf credit card protection / rf credit card / rf chip design / rf card / gps rf chip
Amkor Technology - Wafer Bumping | Flip Chip | RF Design
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WLFO Packaging Solutions
Amkor is a world leader in Wafer-Level Fan-Out, the fastest-growing packaging technology, and one of the advanced packaging platforms that is the most promising. The interest sparked by WLFO stems from all the strong benefits it offers, which are particularly appealing to markets with small-form factor needs, tight transmission loss requirements or high performance demands. WLFO enables flexible System-in-Package (WLSiP) and...
Website:
https://amkor.com
Related topics : rf chip design / rf flip chip
RF Flip-Chip Tuners For Japan's Digital Broadcasts Introduced
Sunnyvale, CA -- Maxim Integrated Products introduces the MAX2161 and MAX2162 dual-band, dual-mode tuners for Japanese digital broadcasts. The devices receive UHF and VHF band III and support both 1-segment and 3-segment broadcasts using the ISDB-T standard. The MAX2161 features an I2C-compatible interface, while the MAX2162 has a 3-wire interface for IC-to-IC communication. The small size of these devices enables product designers to produce television systems that meet the tiny-footprint and low-height requirements of the Japanese cell-phone-TV market.
The MAX2161/MAX2162 tuners contain all...
Website:
rfglobalnet.com
Related topics : rf tuner chip / rf flip chip
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