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STATS ChipPAC - Flip Chip Packages
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Flip Chip Packages
A broad Flip Chip portfolio--from large single die packages with passive components to modules and complex advanced 3D packaging, with a variety of low cost options.
Your Go-To Provider of Flip Chip Solutions
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides the most dense interconnect...
Related topics : rf flip chip / single chip rf
STATS ChipPAC - Flip Chip Packages
Your Go-To Provider for a Broad Range of Advanced and Standard Flip Chip Package Solutions
Flip Chip packaging, in which the silicon die is directly attached to the substrate using solder bumps instead of wirebonds, provides a dense interconnect with the high electrical and thermal performance.??lip Chip interconnection provides the ultimate in miniaturization, reduced package parasitics and...
Related topics : rf flip chip / rf chip design process
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